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Package Specifications
- Sockets Supported FCLGA1366
- Max CPU Configuration 2
- TCASE 75°C
- Package Size 42.5mm x 45mm
- Processing Die Size 263 mm2
- # of Processing Die Transistors 731 million
Advanced Technologies
- Intel® Turbo Boost Technology 1.0
- Intel® Hyper-Threading Technology Yes
- Intel® Virtualization Technology (VT-x) Yes
- Intel® Virtualization Technology for Directed I/O (VT-d) Yes
- Intel® VT-x with Extended Page Tables (EPT) Yes
- Intel® 64 Yes
- Instruction Set 64-bit
- Idle States Yes
- Enhanced Intel SpeedStep® Technology Yes
- Intel® Demand Based Switching Yes
Security & Reliability
- Intel® Tru